- 定價227.00元
-
8
折優惠：HK$181.6
|
|
|
|
PROCESSING OF SEMICONDUCTORS VOL.2
|
|
沒有庫存
訂購需時10-14天
|
|
|
|
|
|
9783527304080 | |
|
|
|
JACKSON、SCHROTER | |
|
|
|
全華科技 | |
|
|
|
2000年1月01日
| |
|
|
|
800.00 元
| |
|
|
|
HK$ 760
|
|
|
|
|
| |
|
|
|
|
| |
|
|
詳
細
資
料
|
* 叢書系列：實用電子
* 規格：平裝 / 716頁 / 普級 / 單色印刷 / 初版
* 出版地：台灣
實用電子
|
|
分
類
|
[ 尚未分類 ] |
同
類
書
推
薦
|
|
|
內
容
簡
介
|
Every microchip is made from a semiconducting material (e.g., silicon), making semiconductors the basis of modern microelectronics. The knowledge of physical basics and the principles of semiconductor processing are essential for the development of the ever evolving microelectronic devices.
|
|
目
錄
|
1.Silicon Processing J.G. Wilkes, K.E. Benson, W. Lin
2.Compound Semiconductor Processing J.B. Mullin
3.Epitaxial Growth T.F. Kuech, M.A. Tischler
4.Photolithography R. Leuschner, G. Pawlowski
5.Selective Doping S. Mahajan
6.Etching Processes in Semiconductor Manufacturing K.G. Donohoe, T.R. Turner, K.A. Jackson
7.Silicon Device Structures C.-Y. Chang, S.M. Sze
8.Compound Semiconductor Device Structures W.E. Stanchina, J.F. Lam
9.Silicon Device Processing D.-L. Kwong
10.Compound Semiductor Device Processing J.M. Parsey, Jr.
11.Integrated Circuit Packaging D.I. Amey
12.Interconnection Systems W.H. Knausenberger
Index
|
|
|
書
評
|
|
|
|
|
